GLancing Angle Deposition (GLAD) or Oblique Angle Deposition (OAD) offers the opportunity to tune the film microstructure and consequently their properties. The idea, successfully developed in evaporation, is based on the orientation of the substrate compare to the vapor source and on the resulting shadow effect. This configuration produces specific column tilt angle and an increased porosity. The relation between the column tilt angle and the substrate angle should theoretically follow the tait’s rule or the tangent rule. Is it is globally true for evaporation, some deviation are reported for sputtering. This is due to the scattering during transport from target to substrate in a 3D reference frame. This implies not only an incident angle but also an azimuthal one.
This work try to explain this deviation based on numerical calculations (SIMTRA  and Simul3D ). Transport results given by SIMTRA are analyzed and a new criterion is extracted and compared to the classical analysis done. The relevancy of this criterion is supported by experimental cases and their corresponding numerical version.
|Category||Short file description||File description||File Size|
|Presentation||Analysis of the particles trajectories on an substrate||Different ways to analyse the particles trajectories impinging on an substrate||209 KB||Download|